From: "Saved by Internet Explorer 11" Subject: PCB Stack-Up - Part 3 Date: Thu, 2 Jul 2015 15:06:20 -0700 MIME-Version: 1.0 Content-Type: text/html; charset="iso-8859-1" Content-Transfer-Encoding: quoted-printable Content-Location: http://www.hottconsultants.com/techtips/pcb-stack-up-3.html X-MimeOLE: Produced By Microsoft MimeOLE V6.1.7601.17609
=20 =20 =20 =One stack-up NOT to use on a six-layer board is the one shown =
in=20
Figure 5. The planes provide no shielding for the signal layers, =
and two=20
of the signal layers (1 and 6) are not adjacent to a plane. The =
only time=20
this arrangement works even moderately well is if all the high frequency =
signals=20
are routed on layers 2 and 5 and only very low frequency signals, or =
better yet=20
no signals at all (just mounting pads), are routed on layers 1 and =
6. If=20
used, any unused area on layers 1 and 6 should be provided with "ground =
fill"=20
and tied into the primary ground plane, with vias, at as many locations =
as=20
possible.
________________Signal
= ________________Signal =20
________________Ground
= ________________Power &nbs= p;  = ; =20 Figure 5
________________Signal
=20 ________________Signal
This configuration satisfies only one (number 3) of our original
objectives.
With six layers available the principle of providing two buried =
layers for=20
high-speed signals (as was done in Fig. 3) is easily implemented as =
shown in=20
Fig. 6. This configuration also provides two surface layers for =
routing=20
low speed signals.
________________Mounting Pads/Low Freq. Signals =
________________Ground
________________High Freq. = Signals =20
________________High Freq. Signals = Figure 6
________________Power
=20 ________________Low Freq. Signals
This is a probably the most common six-layer stack-up and can be =
very=20
effective in controlling emissions, if done correctly. This =
configuration=20
satisfies objectives 1, 2, & 4 but not objectives 3& 5. =
Its main=20
drawback is the separation of the power and ground planes. Due to =
this=20
separation there is no significant interplane capacitance between power =
and=20
ground Therefore, the decoupling must be designed very carefully =
to=20
account for this fact. For more information on decoupling, see our =
Tech =
Tip on=20
Decoupling.
Not nearly as common, but a good performing stack-up for a six-layer =
board is=20
shown in Fig. 7.
________________Signal(H1)
________________Ground
________________Signal (V1) =
= &= nbsp; &n= bsp; &nb= sp; &nbs= p;  = ; = =20 Figure 7
________________Signal (H2) =
________________Power=20
________________Signal (V2)
H1 indicates the horizontal routing layer for signal 1, and V1 =
indicates
the vertical routing layer for signal 1. H2 and V2 represent the =
same for=20
signal 2. This configuration has the advantage that orthogonal =
routed=20
signals always reference the same plane. To understand why this is =
important see section on Changing
Reference Planes in Part 6. The disadvantage is that the =
signals on=20
layer one and six are not shielded. Therefore the signal layers =
should be=20
placed very close to their adjacent planes, and the desired board =
thickness made=20
up by the use of a thicker center core. Typical spacing for a =
0.060" thick=20
board might be 0.005"/0.005"/0.040"/0.005"/0.005". This =
configuration=20
satisfies objectives 1 and 2, but not 3, 4, or 5.
Another excellent performing six-layer board is shown in Fig. 8. It =
provides=20
two buried signal layers and adjacent power and ground planes and =
satisfies all=20
five objectives. The big disadvantage, however, is that it only =
has two=20
routing layers -- so it is not often used.
________________Ground/ Mounting Pads
=20 ________________Signal
________________Ground =
= ________________Power &nbs= p;  = ; = =20 Figure 8
________________Signal
=20 ________________Ground
It is easier to achieve good EMC performance with a six-layer =
board than=20
with a four-layer board. We also have the advantage of four signal =
routing=20
layers instead of being limited to just two. As was the case for=20
four-layer boards, it is possible to satisfy four of our five objectives =
with a=20
six-layer PCB. All five objectives can be satisfied if we limit =
ourselves=20
to only two signal routing layers. The configurations of Figures =
6, 7, and=20
8 all can all be made to perform very well from an EMC point of view. =
=A9 2001 Henry W. = Ott &nbs= p;  = ; = Henry Ott Consultants, 48 Baker Road Livingston, = NJ 07039 (973) 992-1793