=20
| Circuit Board Repair and =
Rework=20
Guide |
|
|
Outline
The=20
information within these guides should be helpful to =
anyone=20
who works with bare circuit boards and circuit board=20
assemblies. These guides are packed with illustrations =
and=20
videos and follow popular IPC standards. These guides =
will=20
help you through the maze of challenges you face when =
working=20
on modern, high density circuit boards. If your =
company=20
complies with ISO-9000 or any demanding quality =
standard, you=20
can refer to these guides as your on-line =
reference.
Guides in sections 1 through 6 detail the proper =
step-by-step=20
techniques, tools and materials, and cautions needed =
to=20
reliably repair and modify bare and assembled circuit=20
boards.
Guides in sections 7 and 8 detail the =
proper=20
step-by-step techniques, tools and materials, and =
cautions=20
needed to reliably rework assembled circuit =
boards.
Each procedure includes a "Conformance Level" =
indicated as=20
high, medium or low. This Conformance Level indicates =
how=20
closely the repaired or reworked product will be to =
the=20
original specifications. The Conformance Level listed =
for each=20
procedure should be used as a guide only.
Each=20
procedure also includes a "Skill Level" providing a =
gauge for=20
the requisite experience and skill needed by the =
operator to=20
obtain a reliable outcome. Skill Levels are listed as=20
intermediate, advanced, or expert. The Skill Level =
recommended=20
should be used as a guide only.
Hundreds of =
detailed=20
illustrations, as shown on the right, are included =
throughout=20
this guidebook. Visit the Foreword for more =
information on=20
this guidebook and how it can be used at your company =
to=20
reduce waste.
Images and Figures
|
| Section 2 covers procedures for =
coating=20
removal and=20
replacement. |
|
| Section 3 covers procedures for =
base=20
board =
repair. |
|
| Section 4 covers procedures for =
conductor=20
repair. |
|
| Section 6 covers jumper wire=20
=
procedures. |
|
| Section 7 and 8 cover soldering =
and=20
desoldering=20
procedures. |
Visit these sections more =
specific=20
information.
1.0 =
Foreword
This=20
section provides substantial background information =
about this=20
guide and how it can be used at you company. =
2.0 Basic =
Procedures
This section covers handling, cleaning, coatings, =
legend, and=20
use of epoxies.
3.0 Base Board=20
Procedures
This section covers repair of =
delamination, warp, key slots, non plated holes, =
surface=20
defects, and various defects to base board material.=20
4.0 Conductor=20
Procedures
This section covers repair =
and rework=20
of conductors including circuits, lands, gold =
contacts,=20
surface mount pads, and BGA pads.
5.0 Plated Hole=20
Procedures
This section covers various =
methods=20
for plated hole repair.
6.0 Jumper Wires and =
Component=20
Modification Procedures
This section =
includes=20
excellent procedures for adding jumper wires and =
performing=20
various component modifications.
7.0 Soldering=20
Procedures
This section includes =
procedures for=20
soldering a variety of component types including chip=20
components, J lead components and gull wing =
components.=20
8.0 Rework=20
Procedures
This section includes =
procedures for=20
removing a variety of component types including chip=20
components, J lead components, and gull wing =
components.=20
9.0 BGA Rework=20
Procedures
This section includes =
procedures for=20
removing and replacing BGA components. Procedure for =
reference=20
only. | =20
|
|
| =20
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Customer Comments =
"We're operating on a tight production schedule, =
with no=20
time to waste. Circuit Technology Center has=20
consistently delivered our boards back to us on =
time,=20
and sometimes even ahead of schedule. This has =
helped us=20
stick to deadlines. Thanks to their fast =
turnaround."=20
S.L. Fremont, CA USA =
Send=20
us your comments =20
| | =20
